JPS6234473U - - Google Patents
Info
- Publication number
- JPS6234473U JPS6234473U JP12465585U JP12465585U JPS6234473U JP S6234473 U JPS6234473 U JP S6234473U JP 12465585 U JP12465585 U JP 12465585U JP 12465585 U JP12465585 U JP 12465585U JP S6234473 U JPS6234473 U JP S6234473U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- storage case
- mold filling
- electronic components
- pellet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
Landscapes
- Casings For Electric Apparatus (AREA)
- Moulding By Coating Moulds (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12465585U JPS6234473U (en]) | 1985-08-15 | 1985-08-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12465585U JPS6234473U (en]) | 1985-08-15 | 1985-08-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6234473U true JPS6234473U (en]) | 1987-02-28 |
Family
ID=31016870
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12465585U Pending JPS6234473U (en]) | 1985-08-15 | 1985-08-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6234473U (en]) |
-
1985
- 1985-08-15 JP JP12465585U patent/JPS6234473U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPS6234474U (en]) | ||
| JPS6234473U (en]) | ||
| JPH04784U (en]) | ||
| JPH0260274U (en]) | ||
| JPS6090843U (ja) | Ｉｃなどの放熱装置 | |
| JPS588966U (ja) | 半導体受光装置 | |
| JPS6389253U (en]) | ||
| JPS6071142U (ja) | 半導体装置 | |
| JPS583035U (ja) | 樹脂モ−ルド用の型 | |
| JPS6115744U (ja) | 半導体装置 | |
| JPS60182123U (ja) | 成形用金型の断熱板 | |
| JPS58189543U (ja) | モ−ルド型半導体装置 | |
| JPS6344479U (en]) | ||
| JPH0336141U (en]) | ||
| JPH01153673U (en]) | ||
| JPS58140647U (ja) | リ−ドフレ−ム | |
| JPS5844841U (ja) | 樹脂封止形半導体装置のモ−ルド金型 | |
| JPS6172896U (en]) | ||
| JPS5830253U (ja) | 温度ヒユ−ズ付ｉｃ | |
| JPS6230348U (en]) | ||
| JPS6122342U (ja) | 半導体装置 | |
| JPS6125122U (ja) | 樹脂モ−ルド装置 | |
| JPH01112054U (en]) | ||
| JPS58138350U (ja) | リ−ドフレ−ム | |
| JPH04743U (en]) |